Advanced Pre-Preg Product Range
FR-4 Standard
Engineered for general purpose multilayer PCBs. Offers excellent dimensional stability and consistent flow characteristics for reliable lamination cycles.
High-Tg Series
Optimized for high-reliability applications and lead-free soldering processes. Maintains structural integrity under thermal stress for complex multilayer stacks.
Halogen-Free
Designed for environmental compliance without sacrificing performance. Excellent bonding strength and thermal resistance for sustainable PCB production.
Technical Data & Material Properties
Our Pre-Preg materials, supplied in partnership with Yao Hong, are designed for HDI and multilayer PCB applications, offering excellent resin flow, reliable bonding, and consistent dielectric performance to ensure dependable lamination results.
Resin Content
Controlled resin levels (RC%) ranging from 45% to 75% for superior bonding and dielectric performance.
Tg & RESIN Flow
High Tg options (170°C+) with optimized resin flow for consistent multilayer lamination cycles.
Glass Style
Available in 106, 1080, 2116, and 7628 styles to match specific impedance and stability requirements.
Thickness Options
Pressed thicknesses from 0.04mm to 0.20mm for high-precision stack-up configurations.
Request a Stack-Up Proposal or Datasheet
Consult our engineers for pricing and process guidance to ensure your multilayer PCB lamination meets global technical standards.