High-Precision Copper Foil Range
Engineered for high-yield PCB manufacturing with consistent surface treatments and thickness control.
ED Copper Foil
Standard and high-elongation electro-deposited foils. Available in 12μm to 105μm thicknesses with optimized surface roughness for multilayer bonding.
RA Copper Foil
Rolled Annealed foils for flex and rigid-flex applications. Featuring superior ductility and high thermal resistance for demanding electronics.
HTE & VLP Foils
Very Low Profile and High-Temperature Elongation foils. Specifically developed for high-frequency signal integrity and heavy copper requirements.
Expert Selection Guidance & Resource Center
Navigating foil selection for complex multilayer boards and high-frequency applications requires precision. Our engineering support team assists Indian manufacturers in identifying the optimal balance of peel strength, roughness (Rz), and thickness to maximize PCB yield and reliability. Access our technical library for comprehensive performance data and industry compliance standards.